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South Korea's Lee says Samsung chip packaging expansion to spur $30 billion additional investment

ET Tech & Digital IndiaBy ET Tech & Digital India
12 Nov 2026
Original: English
AI Synopsis & Key Briefing

Lee made the comment during a groundbreaking ceremony for part of theinvestment plans that Samsung affiliates announced in July.

Key Highlights & Official Takeaways
  • ✓Lee made the comment during a groundbreaking ceremony for part of theinvestment plans that Samsung affiliates announced in July.
  • ✓The new HBM plant will have three floors of clean-room space covering about 31,000 square metres (37,076 square yards), Samsung said.
  • ✓Civic Domain: Categorized under technology public notices.
Comprehensive News & Policy Report

(Catch all the Technology News News, and Latest News Updates on The Economic Times.) SynopsisLee made the comment during a groundbreaking ceremony for part of theinvestment plans that Samsung affiliates announced in July.

ReutersSouth Korean President Lee Jae Myung said on Thursday that Samsung Electronics' 6 trillion won ($4.48 billion) investment in a high-bandwidth memory (HBM) chip packaging plant in Asan, South Korea, would be followed by about 40 trillion won in investment in advanced equipment.

Lee made the comment during a groundbreaking ceremony for part of theinvestment plans that Samsung affiliates announced in July. Samsung Electronics said in a presentation that the new HBM production line is scheduled to begin operations in June 2028, a year earlier than initially planned, as the company seeks to meet rapidly growing demand for server memory.

The new HBM plant will have three floors of clean-room space covering about 31,000 square metres (37,076 square yards), Samsung said. South Korea's government has tapped Samsung, fellow chipmaker SK Hynix and other companies to help drive "mega projects" covering semiconductors, physical artificial intelligence and AI data centres.

Read more news onSamsung Electronicschip packaginghigh-bandwidth memoryAsanSouth Korea (Catch all the Technology News News, and Latest News Updates on The Economic Times.)

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Official Notice Specification
Issuing AuthorityET Tech & Digital India
Topic CategoryTECHNOLOGY
JurisdictionAll India / National
Publication Date12 November 2026
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Official Source Attribution: ET Tech & Digital India
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